Matters to Be Observed When Using This Product

■ Reflow soldering is a soldering method in which the proper amount of solder paste is deposited on the fitting land of

the surface-mounted board, the chip-type laminated film capacitor is placed on the land, and heat is applied to the

capacitor to melt the solder. We recommend the temperature profile shown in the following table for the reflow soldering

process. Note, however, that more than two reflow soldering cycles are not allowed and that the second reflow cycle

must be carried out after the capacitor temperature returns to normal temperature following the end of the first reflow

cycle.

■ Because the chip-type laminated film capacitor is not protected with an outer casing, an activator (halogen, etc.) in

solder paste may corrode the inner deposit electrode, which leads to the degradation of the capacitor characteristics,

such as a drop in the capacitance and an increase in the loss tangent (tanδ). Use solder paste with halogen content

of 0.1 wt%.

■ When cleaning the capacitor right after soldering it, make sure that its surface temperature is 60 ℃ or lower.

■ Maximum surface temperatures capacitors reach during the reflow process are as follows: 260 ℃ at ECHU(X)/(C),

250 ℃ at ECWU(X)/(C), and 240 ℃ at ECPU(A).

A surface temperature higher than these temperatures causes a capacitor problems with its appearance and electrical

characteristics, in which case the reliability of the capacitor cannot be guaranteed.

■ ECWU(X)/(C) and ECPU(A) are put in moisture proofing packages. Once the package is unsealed, the capacitor

absorbs moisture and its resistance to soldering heat drops. Check the note on the package that gives you the

instructions you should follow after unsealing the package. Specific instructions to follow after unsealing the package

are stated in the delivery specification sheet.

■ When using a solder iron, sufficiently preheat the board land with the iron tip and then carry out soldering work.

Do not put the iron tip directly on the body or electrode of a chip-type laminated film capacitor. Particularly, do not

bring the iron tip into contact with a side face (sectional surface) of the capacitor.

A hot solder iron coming in contact with such parts may cause the degradation of the capacitor characteristics,

such as lower insulation resistance and short circuit.

■ Avoid mounting a number of chip-type laminated film capacitors on a board using a solder iron. This process makes

temperature control difficult and may lead to the degradation of the capacitor characteristics. Avoid reusing a capacitor

(component) once removed with a solder iron.

Soldering condition

The capacitor temperature varies

depending on the type of the board material

and the heat source. Use a glass epoxy

board of 115 mm by 50 mm and 0.8 t as

the standard board to check the capacitor

temperature.

Mater to note

Soldering

Item

23-Apr-25

Solder iron wattage: 30 W

280

℃ max.－4s max.

ECPU(A)

260

℃ max.－4s max.

ECWU(X)/(C)

270

℃ max.－4s max.

ECHU(X)/(C)

<Reflow soldering>

The capacitor and the board

are heated in a heat-resistant

furnace or an infrared

furnace.

Soldering time (s)

280

270

260

250

240

1

2

0

3

4

5

Soldering time (s)

280

270

260

250

240

1

2

0

3

4

5

Soldering time (s)

280

270

260

250

240

1

2

0

3

4

5

: Specification range

: Specification range

: Specification range

Soldering: 235

°C, 5 sec. at

maximum

≥220

°C, 30 sec. at maximum

Preheating

150

°C to 180°C

60 sec. to 120

Time (s)

300

250

200

150

100

50

0