TLN227(F)

2007-10-01

2

Precautions

Please be careful of the followings.

1. Soldering must be performed under the lead stopper.

2. When forming the leads, bend each lead under the stopper without leaving forming stress to the

body of the device. Soldering must be performed after the leads have been formed.

3. Radiant power falls over time due to the current which flows in the infrared LED.

When designing a circuit, take into account this change in radiant power over time.