MSC8126VT8000 datasheet(14/48 Pages) FREESCALE

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MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 13

Electrical Characteristics

Freescale Semiconductor

2.2

Recommended Operating Conditions

Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.

2.3

Thermal Characteristics

Table 4 describes thermal characteristics of the MSC8126 for the FC-PBGA packages.

Section 3.5, Thermal Considerations provides a detailed explanation of these characteristics.

Table 3. Recommended Operating Conditions

Rating

Symbol

Value

Unit

Core and PLL supply voltage:

• Standard

— 400 MHz

— 500 MHz

• Reduced (300 and 400 MHz)

VDD

VCCSYN

1.14 to 1.26

1.16 to 1.24

1.07 to 1.13

I/O supply voltage

VDDH

3.135 to 3.465

Input voltage

VIN

–0.2 to VDDH+0.2

Operating temperature range:

• Standard

• Extended

0 to 90

–40 to 105

°C

Table 4. Thermal Characteristics for the MSC8126

Characteristic

Symbol

FC-PBGA

× 20 mm5

Unit

Natural

Convection

200 ft/min

(1 m/s) airflow

Junction-to-ambient1, 2

RθJA

°C/W

Junction-to-ambient, four-layer board1, 3

RθJA

°C/W

Junction-to-board (bottom)4

RθJB

°C/W

Junction-to-case5

RθJC

0.9

°C/W

Junction-to-package-top6

ΨJT

°C/W

Notes:

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

Per JEDEC JESD51-6 with the board horizontal.

Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on

the top surface of the board near the package.

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2.

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