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CD54HC366 Arkusz danych(PDF) 4 Page - Texas Instruments

Numer części CD54HC366
Szczegółowy opis  CDx4HC365-Q1, CD74HC366-Q1 High-Speed CMOS Logic HEX Buffer/Line Driver, Three-State Non-Inverting and Inverting
PDF  18 Pages
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Producent  TI2 [Texas Instruments]
Strona internetowa  https://www.ti.com
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CD54HC366 Arkusz danych(HTML) 4 Page - Texas Instruments

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5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VCC
Supply voltage range
-0.5
7
V
IIK
Input clamp current
VI < -0.5V or VI > VCC + 0.5V
±20
mA
IOK
Output clamp current
VO < -0.5V or VO > VCC + 0.5V
±20
mA
IO
Drain current
VO > -0.5V or VO < VCC + 0.5V
±35
mA
Continuous output current
±25
ICC
Continuous current through VCC or GND
±50
mA
Latch up
Class I
TJ
Junction temperature
150
°C
Tstg
Storage temperature
-65
150
°C
Lead temperature (soldering 10s)
300
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
5.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
1500
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins(2)
250
Machine model
200
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
5.3 Recommended Operating Conditions
MIN
MAX UNIT
VCC
Supply voltage
HC Types
2
6
V
HCT Types
4.5
5.5
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
TA
Operating free-air temperature
–40
125
°C
Δt/Δv
Input Rise and Fall Time
2 V
1000
ns
4.5 V
500
6 V
400
5.4 Thermal Information
THERMAL METRIC
D (SOIC)
UNIT
16 PINS
RθJA
Junction-to-ambient thermal resistance
(1)
73
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
CD74HC365-Q1, CD74HC366-Q1, CD74HCT365-Q1
SCHS382A – JANUARY 2010 – REVISED AUGUST 2022
www.ti.com
4
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Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: CD74HC365-Q1 CD74HC366-Q1 CD74HCT365-Q1



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