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PACKAGE OUTLINE

C

SEE TERMINAL

DETAIL

48X

0.30

0.18

5.1 0.1

48X

0.5

0.3

0.8

0.7

(A) TYP

0.05

0.00

44X 0.5

2X

5.5

2X 5.5

A

7.15

6.85

B

7.15

6.85

0.30

0.18

0.5

0.3

(0.2)

WQFN - 0.8 mm max height

RHS0048A

PLASTIC QUAD FLATPACK - NO LEAD

4214990/B 04/2018

DIM A

OPT 1

OPT 2

(0.1)

(0.2)

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

1

12

25

36

13

24

48

37

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

EXPOSED

THERMAL PAD

49

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 1.800

DETAIL

OPTIONAL TERMINAL

TYPICAL