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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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LCWW5SN Arkusz danych(PDF) 13 Page - OSRAM GmbH |
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LCWW5SN Arkusz danych(HTML) 13 Page - OSRAM GmbH |
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13 / 19 page  LCW W5SN 2007-08-16 13 Empfohlenes Lötpaddesign 8) Seite 19 IR Reflow Löten Recommended Solder Pad 8) page 19 IR Reflow Soldering Thermal enhanced PCB Thermisch optimiertes PCB 3 Lötstellen 3 solder points 1.6 (0.063) 11.6 (0.457) ø4.0 (0.157) Heatsink attach 11.6 (0.457) 12.0 (0.472) ø4.0 (0.157) ø2.5 (0.098) Kupfer Copper 1.6 (0.063) OHPY2844 Solder paste stencil Lötpasten Schablone Lötstopplack Solder resist Bare Copper Freies Kupfer Footprint Empfohlene Padgeometrie Recommended Solder Pad Design Achtung: Anode und Heatsink sind elektrisch verbunden Attention: Anode and Heatsink are electrically connected |
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