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TMP116 Arkusz danych(PDF) 40 Page - Texas Instruments |
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TMP116 Arkusz danych(HTML) 40 Page - Texas Instruments |
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40 / 46 page ![]() www.ti.com PACKAGE OUTLINE C 6X 0.35 0.25 1.6 0.1 6X 0.3 0.2 2X 1.3 1 0.1 4X 0.65 0.8 MAX 0.05 0.00 B 2.1 1.9 A 2.1 1.9 (0.2) TYP WSON - 0.8 mm max height DRV0006B PLASTIC SMALL OUTLINE - NO LEAD 4223922/A 09/2017 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 3 4 6 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED 7 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. SCALE 5.500 |
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