SY75608 datasheet(34/44 Pages) MICROCHIP

34 / 44 page

SY75608/612

DS20006363D-page 34



2021 - 2023 Microchip Technology Inc. and its subsidiaries

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

4.20

MILLIMETERS

0.40 BSC

MIN

MAX

5.90

Contact Pad Length (X48)

Contact Pad Width (X48)

0.85

0.20

NOM

Contact Pad to Center Pad (X48)

0.20

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Contact Pad to Contact Pad (X44)

0.20

ØV

SILK SCREEN

Microchip Technology Drawing C04-2494 Rev A

48-Lead Very Thin Plastic Quad Flat, No Lead (6LX) - 6x6 mm Body [VQFN]

With 4.1x4.1 mm Exposed Pad

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