4

LM809, LM810

SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016

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Copyright © 1999–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

6 Specifications

6.1 Absolute Maximum Ratings

see

(1) (2)

MIN

MAX

UNIT

Input supply voltage

VCC

–0.3

6

V

Output voltage

RESET, RESET

–0.3

VCC + 0.3

V

Input current

VCC

20

mA

Output current

RESET, RESET

20

mA

Rate of rise

VCC

100

V/µs

Continuous power dissipation

320

mW

Lead temperature (soldering, 10 s)

300

°C

Ambient temperature range, TA

–40

105

°C

Maximum junction temperature, TJ(MAX)

125

°C

Storage temperature, Tstg

–65

160

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±200 V may actually have higher performance.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±200

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Input voltage range

TA = 0°C to 70°C

1.0

5.5

V

TA = –40°C to 105°C

1.2

5.5

ICC

Supply Current

VCC < 5.5 V,

LM8xx: 4.63, 4.38, 4.00

TA = –40°C to 85°C

18

60

µA

TA = 85°C to 105°C

100

VCC < 3.6 V,

LM8xx: 3.08, 2.93, 2.63, 2.45

TA = –40°C to 85°C

15

50

TA = 85°C to 105°C

100

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LM809, LM810

UNIT

DBZ (SOT-23)

3 PINS

RθJA

Junction-to-ambient thermal resistance

252.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

113.3

°C/W

RθJB

Junction-to-board thermal resistance

53.5

°C/W

ψJT

Junction-to-top characterization parameter

9.9

°C/W

ψJB

Junction-to-board characterization parameter

52.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W