LP4950C-5V, LP4951C

SNVS208C – SEPTEMBER 2002 – REVISED APRIL 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1)

Input Supply Voltage

−0.3 to +30V

SHUTDOWN Input Voltage,

−0.3 to +30V

Error Comparator Output

Voltage, (2)

FEEDBACK Input Voltage

(2) (3)

−1.5 to +30V

Power Dissipation

Internally Limited

Junction Temperature (TJ)

+150°C

Ambient Storage Temperature

−65° to +150°C

ESD Rating

Human Body Model (4)

2 kV

For soldering specifications, see the following document: www.ti.com/lit/snoa549

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2)

May exceed input supply voltage.

(3)

When used in dual-supply systems where the output terminal sees loads returned to a negative supply, the output voltage should be

diode-clamped to ground.

(4)

Human Body Model 1.5 k

Ω in series with 100 pF. LP4950 - passes 2 kV HBM. LP4951 - All pins pass 2 kV except Vfb -1000V.

OPERATING RATINGS

(1)

Maximum Input Supply Voltage

30V

Junction Temperature Range(2)

LP4950C, LP4951C

−40°C to 125°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2)

The junction-to-ambient thermal resistances are as follows: 180°C/W and 160°C/W for the TO-92 package with 0.40 inch and 0.25 inch

leads to the printed circuit board (PCB) respectively, 160°C/W for the molded plastic SOIC (D). The above thermal resistances for the

SOIC package apply when the package is soldered directly to the PCB.

2

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