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PCM1870 Arkusz danych(PDF) 49 Page - Texas Instruments |
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PCM1870 Arkusz danych(HTML) 49 Page - Texas Instruments |
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49 / 52 page ![]() www.ti.com PACKAGE OUTLINE C SEE TERMINAL DETAIL 24X 0.30 0.18 2.65 0.1 24X 0.5 0.3 1 MAX (0.1) TYP 0.05 0.00 20X 0.5 2X 3 2X 2 3.65 0.1 B 4.1 3.9 A 5.1 4.9 0.30 0.18 0.5 0.3 VQFN - 1 mm max height RHF0024A PLASTIC QUAD FLATPACK - NO LEAD 4219064 /A 04/2017 PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 7 13 19 8 12 24 20 (OPTIONAL) PIN 1 ID 0.1 C B A 0.05 EXPOSED THERMAL PAD 25 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 3.000 DETAIL OPTIONAL TERMINAL TYPICAL |
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