6.5 Recommended Stencil Opening

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EXAMPLE STENCIL DESIGN

.000 PKG

0

(

)

2.9

(

)

1.175

(

)

0.305

(

)

1.375

(

)

2.245

29X (0.6)

16X (0.25)

14X (0.45)

3X (

)

0.13

3X (

)

1.05

3X (

)

1.25

4X (

)

2.17

(

)

2.6

(

) TYP

3.2

(

) TYP

2.75

(

)

0.375

(

)

0.25

(

)

0.025

(

)

0.1

(

)

0.4

(

)

0.84

(

)

1.05

10X (0.25)

19X (0.45)

23X (0.25)

(R0.05) TYP

(R0.05) TYP

VQFN-CLIP - 1.05 mm max height

RRB0041A

PLASTIC QUAD FLATPACK - NO LEAD

4224073/A 03/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PAST EXAMPLE

BASED ON 0.125 mm THICK STENCIL

PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

PADS 7-9 & 20-24: 70%

PAD 40: 70%

SCALE: 20X

EXPOSED METAL

TYP

METAL UNDER

SOLDER MASK

TYP

SOLDER MASK

EDGE

TYP

EXPOSED METAL

TYP

1

6

9

10

19

20

29

24

25

30

39

40

41

7

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning

and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525

may have alternate design recommendations.

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CSD95430RRB

SLPS759 – JANUARY 2023

Copyright © 2023 Texas Instruments Incorporated

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