5

SN74LVC1G79

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SCES220U – APRIL 1999 – REVISED APRIL 2017

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Copyright © 1999–2017, Texas Instruments Incorporated

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating

CMOS Inputs, SCBA004.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

Operating

1.65

5.5

V

Data retention only

1.5

VIH

High-level input voltage

VCC = 1.65 V to 1.95 V

0.65 × VCC

V

VCC = 2.3 V to 2.7 V

1.7

VCC = 3 V to 3.6 V

2

VCC = 4.5 V to 5.5 V

0.7 × VCC

VIL

Low-level input voltage

VCC = 1.65 V to 1.95 V

0.35 × VCC

V

VCC = 2.3 V to 2.7 V

0.7

VCC = 3 V to 3.6 V

0.8

VCC = 4.5 V to 5.5 V

0.3 × VCC

VI

Input voltage

0

5.5

V

VO

Output voltage

0

VCC

V

IOH

High-level output current

VCC = 1.65 V

–4

mA

VCC = 2.3 V

–8

VCC = 3 V

–16

–24

VCC = 4.5 V

–32

IOL

Low-level output current

VCC = 1.65 V

4

mA

VCC = 2.3 V

8

VCC = 3 V

16

24

VCC = 4.5 V

32

Δt/Δv

Input transition rise or fall rate

VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V

20

ns/V

VCC = 3.3 V ± 0.3 V

10

VCC = 5 V ± 0.5 V

5

TA

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

SN74LVC1G79

UNIT

DBV (SOT-23)

DCK (SC70)

DRL (SOT)

YZP (DSBGA)

5 PINS

5 PINS

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

247.2

277.6

294.3

144.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

154.5

179.5

129.9

1.3

°C/W

RθJB

Junction-to-board thermal resistance

86.8

75.9

143.4

39.9

°C/W

ψJT

Junction-to-top characterization parameter

58.0

49.7

14.3

0.5

°C/W

ψJB

Junction-to-board characterization

parameter

86.4

75.1

144.0

39.7

°C/W