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CDCDB2000ENPPR Arkusz danych(PDF) 5 Page - Texas Instruments

Numer części CDCDB2000ENPPR
Szczegółowy opis  CDCDB2000 DB2000QL-Compliant 20-Output Clock Buffer for PCIe Gen 1 to Gen 5
PDF  35 Pages
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Strona internetowa  https://www.ti.com
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CDCDB2000ENPPR Arkusz danych(HTML) 5 Page - Texas Instruments

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Table 4-1. Pin Functions (continued)
PIN
I/O TYPE(2)
DESCRIPTION
NAME(1)
NO.
SBEN
E2
I, S, PD
Side-Band Interface enable input with internal 120-kΩ pulldown. Typically
connected to GPIO of microcontroller. If unused, the pin can be left no connect.
This pin disables the Output Enable (OE#) pins when asserted.
LOW: OE# pins and SMBus enable bits control outputs, Side-Band interface
disabled.
HIGH: Side-Band Interface controls outputs, OE# pins and SMBus enable bits are
disabled.
SMBUS AND SMBUS ADDRESS
SADR0
B4
I, S, PU / PD
SMBus address strap bit[0]. This is a 3-level input that is decoded in conjunction
with pin B8 to set SMBus address. It has internal 120-kΩ pullup / pulldown network
biasing to VDD/2 when no connect.
For a high-level input configuration, the pin should be pulled up to 3.3-V VDD
through an external pullup resistor from 1k to 5k with 5% tolerance.
For a low-level input configuration input, the pin should be pulled down to ground
through an external pulldown resistor from 1k to 5k with 5% tolerance.
For a mid-level input configuration, the pin should be left floating and not
connected to VDD or ground.
SADR1
B8
I, S, PU / PD
SMBus address strap bit[1]. This is a 3-level input that is decoded in conjunction
with pin B4 to set SMBus address. It has internal 120-kΩ pullup / pulldown network
biasing to VDD/2 when no connect.
For a high-level input configuration, the pin should be pulled up to 3.3-V VDD
through an external pullup resistor from 1k to 5k with 5% tolerance.
For a low-level input configuration, the pin should be pulled down to ground
through an external pulldown resistor from 1k to 5k with 5% tolerance.
For a mid-level input configuration, the pin should be left floating and not
connected to VDD or ground.
SMBCLK
L5
I
Clock pin of SMBus interface. Typically pulled up to 3.3-V VDD using external
pullup resistor. The recommended pullup resistor value is > 8.5k.
SMBDAT
L4
I / O
Data pin of SMBus interface. Typically pulled up to 3.3-V VDD using external pullup
resistor. The recommended pullup resistor value is > 8.5k.
SUPPLY VOLTAGE AND GROUND
GND
DAP
G
Ground. Connect ground pad to system ground.
VDD
B2, B6, B11, L2,
L11
P
Power supply input for LP-HCSL clock output channels. Connect to 3.3-V power
supply rail with decoupling capacitor to GND. Place a 0.1-µF capacitor close to
each supply pin between power supply and ground.
VDD_A
H2
P
Power supply input for differential input clock. Connect to 3.3-V power supply rail
with decoupling capacitor to GND. Place a 0.1-µF capacitor close to pin.
NO CONNECT
NC
B3, B5, B7, B9, C2,
D2, D11, F2, F11,
G2, G11, J2, J11,
K2, L3, L6, L7, L9,
Do not connect to GND or VDD.
(1)
The “#” symbol at the end of a pin name indicates that the active state occurs when the signal is at a low voltage level. When “#” is not
present, the signal is active high.
(2)
The definitions below define the I/O type for each pin.
I = Input
O = Output
I / O = Input / Output
PU / PD = Internal 120-kΩ Pullup / Pulldown network biasing to VDD/2
PD = Internal 120-kΩ Pulldown
S = Hardware Configuration Pin
P = Power Supply
G = Ground
www.ti.com
CDCDB2000
SNAS787B – NOVEMBER 2019 – REVISED OCTOBER 2024
Copyright © 2024 Texas Instruments Incorporated
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