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ASFC Arkusz danych(PDF) 30 Page - Alliance Semiconductor Corporation

Numer części ASFC
Szczegółowy opis  Industrial embedded MMC 5.1 32 GBytes up to 128 GBytes
PDF  42 Pages
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Producent  ALSC [Alliance Semiconductor Corporation]
Strona internetowa  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

ASFC Arkusz danych(HTML) 30 Page - Alliance Semiconductor Corporation

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HS200 Device Output Timing
tPH parameter is defined to allow device output delay to be longer than tPERIOD. After initialization, the tPH may
have random phase relation to the clock. The Host is responsible to find the optimal sampling point for the
Device outputs, while switching to the HS200 mode.
Figure 20 and Table 29 define Device output timing.
While setting the sampling point of data, a long term drift, which mainly depends on temperature drift,
should be considered. The temperature drift is expressed by
ΔTPH. Output valid data window (tVW) is available
regardless of the drift (
ΔTPH) but position of data window varies by the drift, as described in Figure 21.
Figure 20: HS200 Device Output Timing
Note: VOH denotes VOH(min.) and VOL denotes VOL(max.).
Table 29: Output Timing
Symbol
Min.
Max.
Unit
Remark
tPH
0
2
UI
Device output momentary phase from CLK input to CMD or DAT
lines output. Does not include a long term temperature drift.
ΔTPH
-350
(
ΔT=
-20°C)
+1550
(
ΔT=90°C)
ps
Delay variation due to temperature change after tuning. Total
allowable shift of output valid window (TVW) from last system
Tuning procedure
ΔTPH is 2600ps for ΔT from -25°C to 85°C during
operation.
TVW
0.575
-
UI
tVW=2.88ns at 200MHz Using test circuit in Figure 15 including skew
among CMD and DAT lines created by the Device. Host path may
add Signal Integrity induced noise, skews, etc. Expected TVW at
Host input is larger than 0.475UI.
Note
:Unit Interval (UI) is one bit nominal time. For example, UI=5ns at 200MHz.
Confidential
-30
/42-
Rev.1.0 July 2023
32GB/64GB/128GB eMMC



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