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TS2007 Arkusz danych(PDF) 26 Page - STMicroelectronics |
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TS2007 Arkusz danych(HTML) 26 Page - STMicroelectronics |
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26 / 29 page ![]() Package information TS2007 26/29 Doc ID 13123 Rev 4 5 Package information In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. Figure 52. Pinout (top view) Figure 53. Marking (top view) Figure 54. Recommended footprint for the TS2007 DFN8 package 1 2 3 4 8 7 6 5 1 2 3 4 8 7 6 5 Logo: ST Part number: K007 Three digit date code: YWW The dot is for marking pin 1 1.8 mm 0.8 mm 0.35 mm 0.65 mm 1.4 mm 2.2 mm Obsolete Product(s) - Obsolete Product(s) |
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