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AMC7832IPAPRG4.B Arkusz danych(PDF) 71 Page - Texas Instruments |
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AMC7832IPAPRG4.B Arkusz danych(HTML) 71 Page - Texas Instruments |
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71 / 74 page ![]() www.ti.com PACKAGE OUTLINE C 64X 0.27 0.17 60X 0.5 PIN 1 ID (0.127) TYP 0.15 0.05 0 -7 4X 7.5 12.2 11.8 TYP 7.00 5.99 B 10.2 9.8 NOTE 3 A 10.2 9.8 NOTE 3 0.75 0.45 0.25 GAGE PLANE 1.2 MAX (1) PLASTIC QUAD FLATPACK PowerPAD TQFP - 1.2 mm max height PAP0064G PLASTIC QUAD FLATPACK 4218924/A 01/2022 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. 4. Strap features may not be present. 5. Reference JEDEC registration MS-026. PowerPAD is a trademark of Texas Instruments. TM 1 16 17 32 33 48 49 64 0.08 C A B SEE DETAIL A SEATING PLANE A 17 DETAIL A TYPICAL 0.08 C SCALE 1.300 1 16 17 32 33 48 49 64 65 |
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