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STMPS2141STR Arkusz danych(PDF) 25 Page - STMicroelectronics |
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STMPS2141STR Arkusz danych(HTML) 25 Page - STMicroelectronics |
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25 / 30 page ![]() STMPS2141, STMPS2151, STMPS2161, STMPS2171 Package mechanical data 25/30 8 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 53. SOT23-5L package outline Table 17. SOT23-5L mechanical data Symbol. millimeters inches Min Typ Max Min Typ Max A 0.90 1.45 35.4 57.1 A1 0.00 0.10 0.0 3.9 A2 0.90 1.30 35.4 51.2 b 0.35 0.50 13.7 19.7 C 0.09 0.20 3.5 7.8 D 2.80 3.00 110.2 118.1 E 1.50 1.75 59.0 68.8 e 0.95 37.4 H 2.60 3.00 102.3 118.1 L 0.10 0.60 3.9 23.6 . |
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