L9301 datasheet(10/54 Pages) STMICROELECTRONICS

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Electrical specifications

L9301

10/54

DS11400 Rev 9

3.3

Operating range

3.4

Thermal data

Figure 3. Device assembled on 2s2p PCB with high density vias in contact with a metal plate

Table 5. Operating range

Symbol

Parameter

Min.

Max.

Unit

Supply voltage

VB_UV

VDD

Stabilized supply voltage

VDD_UV

VDD_OV

VDD_IO

Logic output supply voltage

3.0

5.5

Table 6. Thermal data

Symbol

Parameter

Min.

Typ.

Max.

Unit

Tamb(1)

Operating ambient temperature

-40

125

°C

Tstg

Storage temperature

-40

150

°C

Junction temperature

-40

175

°C

Tsd

Thermal shutdown temperature

180

195

°C

Tsd-hys

Thermal shutdown temperature hysteresis

°C

1. For information only, in any case Tj limits must not exceed.

Table 7. Thermal resistance

Symbol

Parameter

Working conditions

Value

Unit

Rth j-amb

Junction to ambient

2s2p (4L) board; Natural convection(1)

°C/W

2s2p (4L) board on ECU metal plate(2)

°C/W

Rth j-bottom case Junction to bottom case

Bottom cold plate(3)

°C/W

Rth j-top case

Junction to top case

Top cold plate(4)

°C/W

Psij-top case

Psi Junction to top case

2s2p (4L) board; Natural convection (1)

°C/W

1. Jedec STD. JESD51.

2. Package assembled on 2s2p (4L) board. The board bottom side is in contact with a metal plate as per typical automotive

application (ECU system). See Figure 3.

3. Thermal resistance between the die and the bottom case surface in ideal contact and measured by cold plate as per Jedec

best practice guidelines (JESD51).

4. Thermal resistance between the die and the top case surface in ideal contact and measured by cold plate as per Jedec

best practice guidelines (JESD51).

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