CB45000 datasheet(9/16 Pages) STMICROELECTRONICS

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CB45000 SERIES

Packages in Production

Packages in Development

NUMBER

OF LEADS

(Pins)

PACKAGE NAME

PQFP

TQFP

BGA

PLCC

POWER PQFP

Slug/Spreader

100

120

128

144

160

176

180

208

224

225

256

257

304

352

400

480

PACKAGE AVAILABILITY

The

CB45000

Series

designed

compatible with QFP, BGA and SBC package

types, in addition to the more traditional types

found.

The options include Plastic Leaded Chip Carriers

(PLCC) up to 84 pins, while the Metric Quad Flat

Pack (xQFP) offering ranges up to 208 pins. Both

high performance and high power variants are

available as well as the TQFP thin types.

Figure 6

Packaging Capability

Ball Grid Array (BGA) packages are available

from 160 to 500 pins with further developments

planned in the near future. SBC types allow the

pin count to reach the area of 1000 pins.

The diversity in pin count and package style gives

the designer the opportunity to ﬁnd the best

compromise

for

system

size,

cost

and

performance requirements.

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