Characteristics

STPS1L20MF

4/7

Doc ID 12640 Rev 2

Figure 11.

Thermal resistance junction to ambient versus copper surface under tab

(epoxy printed board FR4, copper thickness = 35 µm, typical values)

Figure 7.

Reverse leakage currrent versus

reverse voltage applied

(typical values)

Figure 8.

Reverse leakage currrent versus

junction temperature

(typical values)

Figure 9.

Junction capacitance versus

reverse voltage applied

(typical values)

Figure 10.

Forward voltage drop versus

forward current

I (mA)

R

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

0

2

4

6

8

1012

1416

1820

V (V)

R

T =125°C

j

T =150°C

j

T =100°C

j

T =50°C

j

T =25°C

j

T =75°C

j

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

0

25

50

75

100

125

150

I (mA)

R

T (°C)

j

V =20V

R

C(pF)

10

100

1000

1

10

100

V (V)

R

F=1MHz

V

=30mV

T =25°C

OSC

RMS

j

I

(A)

FM

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

V

(V)

FM

T =25°C

(maximum values)

j

T =85°C

(maximum values)

j

T =85°C

(typical values)

j

R

(°C/W)

th(j-a)

0

50

100

150

200

250

0

20

40

60

80

100

120

140

160

180

200

S(mm²)