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STPS8L30DEE Arkusz danych(PDF) 5 Page - STMicroelectronics |
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STPS8L30DEE Arkusz danych(HTML) 5 Page - STMicroelectronics |
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5 / 9 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 PowerFLAT 3.3x3.3 mm package information Figure 9. PowerFLAT 3.3x3.3 mm package outline Table 4. PowerFLAT 3.3x3.3 mm mechanical data Ref. Dimensions Millimeters Min. Typ. Max. A 0.90 1.10 A3 0.20 b 0.29 0.44 D 3.20 3.40 D2 1.61 1.82 E 3.20 3.40 E2 2.19 2.39 E3 1.54 1.74 e 0.55 0.75 L 0.30 0.50 L1 0.50 0.70 STPS8L30DEE Package information DS9066 - Rev 2 page 5/9 |
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