SN74LVC2G06

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SCES307J – AUGUST 2001 – REVISED JULY 2015

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX UNIT

Operating

1.65

5.5

VCC

Supply voltage

V

Data retention only

1.5

VCC = 1.65 V to 1.95 V

0.65 × VCC

VCC = 2.3 V to 2.7 V

1.7

VIH

High-level input voltage

V

VCC = 3 V to 3.6 V

2

VCC = 4.5 V to 5.5 V

0.7 × VCC

VCC = 1.65 V to 1.95 V

0.35 × VCC

VCC = 2.3 V to 2.7 V

0.7

VIL

Low-level input voltage

V

VCC = 3 V to 3.6 V

0.8

VCC = 4.5 V to 5.5 V

0.3 × VCC

VI

Input voltage

0

5.5

V

VO

Output voltage

0

5.5

V

VCC = 1.65 V

4

VCC = 2.3 V

8

IOL

Low-level output current

16

mA

VCC = 3 V

24

VCC = 4.5 V

32

VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V

20

Δt/Δv Input transition rise or fall rate

VCC = 3.3 V ± 0.3 V

10

ns/V

VCC = 5 V ± 0.5 V

5

TA

Operating free-air temperature

–40

125

°C

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

SN74LVC2G06

DBV (SOT-

DCK (SC70)

DRY (SON)

YPZ (DSBGA)

DSF (SON)

THERMAL METRIC(1)

UNIT

23)

6 PINS

6 PINS

6 PINS

6 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

165

259

234

123

300

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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