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TMP512 Arkusz danych(PDF) 55 Page - Texas Instruments |
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TMP512 Arkusz danych(HTML) 55 Page - Texas Instruments |
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55 / 62 page ![]() www.ti.com PACKAGE OUTLINE C 16X 0.38 0.23 2.7 0.1 16X 0.5 0.3 1.0 0.8 (0.2) TYP 0.05 0.00 12X 0.65 4X 1.95 A 4.1 3.9 B 4.1 3.9 VQFN - 1 mm max height RSA0016B PLASTIC QUAD FLATPACK - NO LEAD 4219093/A 08/2021 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 4 9 12 5 8 16 13 X 0.3) (45 PIN 1 ID 0.1 C A B 0.05 C EXPOSED THERMAL PAD SYMM 17 SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 4. Reference JEDEC registration MO-220. SCALE 3.300 |
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