Characteristics

BAR42, BAR43

4/7

DocID3288 Rev 5

Figure 7. Thermal resistance junction to ambient versus copper surface under each

lead

Figure 5. Junction capacitance versus reverse

voltage applied (typical values)

Figure 6. Relative variation of thermal

impedance junction to ambient versus pulse

duration

12

5

10

20

30

1

2

5

10

C(pF)

V (V)

R

F=1MHz

T =25°C

j

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

0.01

0.10

1.00

Z/R

th(j-a)

th(j-a)

T

δ=tp/T

tp

t (s)

p

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

epoxy FR4 with recommended pad layout, e = 35 µm

Cu

0

5

10

15

20

25

30

35

40

45

50

150

200

250

300

350

R

(°C/W)

th(j-a)

S(CU)(mm²)

P=0.25W

Epoxy printed circuit board FR4, copper thickness: 35 µm