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CSC2690 Arkusz danych(PDF) 2 Page - Multicomp Pro |
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CSC2690 Arkusz danych(HTML) 2 Page - Multicomp Pro |
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2 / 4 page ![]() Page <2> V1.0 23/02/24 Single Bipolar Transistor Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro Recommended Reflow Solder Profiles The recommended reflow solder profiles for Pb and Pb-free devices are shown below. Figure 1 shows the recommended solder profile for devices that have Pb-free terminal plating, and where a Pb-free solder is used. Figure 2 shows the recommended solder profile for devices with Pb-free terminal plating used with leadedsolder, or for devices with leaded terminal plating used with a leaded solder. Reflow profiles in tabular form Profile Feature Sn-Pb System Pb-Free System Average Ramp-Up Rate ~3°C/second ~3°C/second Preheat – Temperature Range – Time 150-170°C 60-180 seconds 150-200°C 60-180 seconds Time maintained above: – Temperature – Time 200°C 30-50 seconds 217°C 60-150 seconds Peak Temperature 235°C 260°C max. Time within +0 -5°C of actual Peak 10 seconds 40 seconds Ramp-Down Rate 3°C/second max. 6°C/second max. |
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