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STM32F101X8 Arkusz danych(PDF) 73 Page - STMicroelectronics |
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STM32F101X8 Arkusz danych(HTML) 73 Page - STMicroelectronics |
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73 / 101 page  DocID13586 Rev 17 73/101 STM32F101x8, STM32F101xB Package characteristics 100 6 Package characteristics 6.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 6.2 UFQFPN48 package information Figure 37. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the QFPN package, this pad is not internally connected to the VSS or VDD power pads. It is recommended to connect it to VSS. 3. All leads/pads should also be soldered to the PCB to improve the lead solder joint life. |
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