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L239B Arkusz danych(PDF) 9 Page - STMicroelectronics |
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L239B Arkusz danych(HTML) 9 Page - STMicroelectronics |
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9 / 12 page ![]() MOUNTING INSTRUCTIONS The Rth j-amb of the L293B and the L293E can be re- duced by soldering the GND pins to a suitable cop- per area of the printed circuit board as shown in fig- ure 12 or to an external heatsink (figure 13). During soldering the pins temperature must not ex- ceed 260 oC and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure12:Example of P.C. Board Copper Area which is Used as Heatsink Figure 13 :External Heatsink Mounting Ex- ample (Rth = 30 oC/W) L293B - L293E 9/12 |
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