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LM61BIM3 Arkusz danych(PDF) 4 Page - National Semiconductor (TI) |
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LM61BIM3 Arkusz danych(HTML) 4 Page - National Semiconductor (TI) |
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4 / 10 page ![]() Typical Performance Characteristics The LM61 in the SOT-23 package mounted to a printed cir- cuit board as shown in Figure 2 was used to generate the following thermal curves. Thermal Resistance Junction to Air Thermal Time Constant 01289703 01289704 Thermal Response in Still Air with Heat Sink Thermal Response in Stirred Oil Bath with Heat Sink 01289705 01289706 Thermal Response in Still Air without a Heat Sink Quiescent Current vs. Temperature 01289708 01289709 www.national.com 4 |
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