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Vishay Dale Thin Film

Revision: 14-Mar-2019

2

Document Number: 60124

For technical questions, contact: thinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

DIMENSIONS in inches

CASE SIZE

L

W

T

D

E

0402

0.042 ± 0.008

0.022 ± 0.005

0.015 ± 0.003

0.010 ± 0.005

0.010 ± 0.005

0603

0.064 ± 0.006

0.032 ± 0.005

0.015 ± 0.003

0.012 ± 0.005

0.015 ± 0.005

0805

0.080 ± 0.006

0.050 ± 0.005

0.015 ± 0.003

0.016 ± 0.008

0.015 ± 0.005

1206

0.126 ± 0.008

0.063 ± 0.005

0.015 ± 0.003

0.020 + 0.005 / - 0.01

0.020 + 0.005 / -0.01

ENVIRONMENTAL TESTS

ENVIRONMENTAL TEST

CONDITIONS

TYPICAL VISHAY

PERFORMANCE

High temperature storage

MIL-STD-202 method 108, 1000 h at 125 °C

± 0.05 %

Temperature cycling

JESD22 method JA-104, 1000 cycles,

-55 °C to +155 °C

± 0.115 %

Moisture resistance

MIL-STD-202 method 106

± 0.017 %

Biased humidity

MIL-STD-202 method 103, 1000 h at 85 °C, 85 % RH,

10 % rated power

± 0.133 %

Life

MIL-STD-202 method 108,

1000 h at 155 °C

± 0.20 % at 100 %

rated power and 155 °C.

Effective film temperature is 200 °C.

Mechanical shock

MIL-STD-202 method 213, condition C

± 0.008 %

Vibration

MIL-STD-202 method 204, 10 Hz to 2 kHz

± 0.008 %

Resistance to soldering heat

MIL-STD-202 method 210, condition B

± 0.09 %

Electrostatic discharge

AEC-Q200-002, human body

(< 1 k

: 1 kV; > 1 k: 2 kV)

± 0.10 % at 2 kV

Solderability

MIL-STD-883 method 2003 para 2.3.1 and J-STD-002

Pass

Die shear

MIL-PRF-55342

Pass

Flame retardance

AEC-Q200-001 para 4.0

Pass

MECHANICAL SPECIFICATIONS

Resistive element

Tantalum nitride

Substrate material

Alumina

Terminations

Gold (10 μin. min.) over nickel (50 μin. min.)

DERATING CURVE

D

L

E

T

W

L

DT

Ambient Temperature °C

- 55

0250

0

20

40

60

80

100

50

100

200

155