MPC7445 datasheet(34/60 Pages) FREESCALE

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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

Freescale Semiconductor

Package Description

8.6

Mechanical Dimensions for the MPC7448, 360 HCTE

RoHS-Compliant BGA

Figure 13 provides the mechanical dimensions and bottom surface nomenclature for the MPC7448, 360

HCTE BGA package with RoHS-compliant lead-free spheres.

Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7448,

360 HCTE RoHS-Compliant BGA Package

NOTES:

1. Dimensioning and

tolerancing per ASME

Y14.5M, 1994

2. Dimensions in millimeters.

3. Top side A1 corner index is a

metalized feature with

various shapes. Bottom side

A1 corner is designated with

a ball missing from the array.

4. Dimension A1 represents the

collapsed sphere diameter.

0.2

360X

A1 CORNER

0.2

123456789 10 111213141516

0.3

0.15

0.15 A

171819

Millimeters

Dim

Min

Max

1.92

2.40

A1 4

0.40

0.60

0.70

0.90

—

0.6

0.60

0.90

25.00 BSC

—

11.3

8.0

—

6.5

7.2

7.4

1.27 BSC

25.00 BSC

—

11.3

8.0

—

6.5

7.9

8.1

Capacitor Region

0.35 A

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