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LXK2-PL12-R00 Arkusz danych(PDF) 14 Page - Lumileds Lighting Company |
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LXK2-PL12-R00 Arkusz danych(HTML) 14 Page - Lumileds Lighting Company |
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14 / 41 page ![]() 14 LUXEON K2 Datasheet DS51 (7/07) Solder Pad Design—SMT Lead Form Notes for Figure 2: 1. Electrical isolation is required between signal leads and hexagonal heat slug contact. 2. For optimal thermal performance, maximize board metallization at hexagonal heat slug contact. Solder Pad Layout—SMT Lead Form Pin Out Diagram Figure 2. 4Lead Gullwing Solder Pad Design. Figure 3. 4Lead Gullwing Package Solder Pad Layout. Conductive Pad Conductive Pad Soldermask Package Outline Conductive Pad Figure 4. 4Lead Gullwing Pin Out Diagram. |
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