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STM32L462CEY3 Arkusz danych(PDF) 179 Page - STMicroelectronics

Numer części STM32L462CEY3
Szczegółowy opis  Ultra-low-power ARM® Cortex®-M4 32-bit MCUFPU, 100DMIPS, 512KB Flash, 160KB SRAM, analog, audio, AES
PDF  198 Pages
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L462CEY3 Arkusz danych(HTML) 179 Page - STMicroelectronics

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STM32L462CE STM32L462RE STM32L462VE
Package information
195
Figure 43. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array
package recommended footprint
Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Other optional marking or inset/upset marks, which identify the parts throughout supply
chain operations, are not indicated below.
F
0.700
0.750
0.800
0.0276
0.0295
0.0315
ddd
-
-
0.100
-
-
0.0039
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 90. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5
Dpad
0.280 mm
Dsm
0.370 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.280 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Table 89. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
Max.



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