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DSC1001 Arkusz danych(PDF) 6 Page - Microchip Technology |
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DSC1001 Arkusz danych(HTML) 6 Page - Microchip Technology |
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6 / 31 page ![]() DSC1001/3/4 DS20005529D-page 6 2017 - 2025 Microchip Technology Inc. and its subsidiaries TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Operating Temperature Range TA –40 — +105 °C Ordering Option L –40 — +85 °C Ordering Option I –20 — +70 °C Ordering Option E Junction Operating Temperature TJ — — +150 °C — Storage Temperature Range TA –55 — +150 °C — Soldering Temperature Range TS — — +260 °C 40 sec. max Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. |
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