7.3 Power Supply Recommendations

7.4 Layout

7.4.1 Layout Guidelines

Figure 7-5 shows example layout for TRF2001. Only the top signal layer (layer 1) and second ground layer (layer

2) are shown. Use a multilayer board to maintain signal integrity and power integrity.

• Route the RF signals as grounded coplanar waveguide (GCPW) traces.

• Maintain that the ground planes on the top and any internal layers are well stitched with vias, and the second

layer of the PCB has a continuous ground layer without any cutouts in the vicinity of the device.

• Avoid routing clocks and digital control lines near RF signal lines.

• Do not route RF or DC signal lines over noisy power planes.

• Place supply decoupling caps close to the device.

• Use small-footprint, passive components wherever possible.

See the TRF2001 Evaluation Module user's guide for more details on board layout and design. The TRF2001

can be evaluated using EVM boards that can be ordered from the TRF2001 Evaluation Module web page.

7.4.1.1 Thermal Considerations

The TRF2001 is packaged in a WQFN-FCRLF package that has excellent thermal properties. Connect the

thermal pads underneath the device to the thermally dissipative ground plane on the board. For good thermal

design, use thermal vias to connect the thermal pad plane on the top layer of the PCB to the ground planes in

the inner layers.

7.4.2 Layout Example

Place supply decoupling

capacitors as close to the

supply pins as possible

Place ferrite bead in series with the

supply source and prior to the decoupling

capacitors on the supply trace

Pin 1

Follow the device PCB footprint

guideline and leave the metal opening

under the device on the top layer

Top metal layer is signal

layer 1 and poured

copper is ground layer 2

2D View

3D View

Figure 7-5. Layout Example

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TRF2001

SLVSK83 – APRIL 2026

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