MPXV6115V

Sensors

Freescale Semiconductor, Inc.

7

4

Package Information

4.1

Minimum recommended footprint for surface mounted applications

Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the

correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the

packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask

layer to avoid bridging and shorting between solder pads.

Figure 9. SOP footprint (case 98ASB17756C)

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 6X

2.54

0.300

7.62

inch

mm

SCALE 2:1