Tel

:

+44 118 979 1238

Fax :

+44 118 979 1283

Email: info@actcrystals.com

In keeping with our ongoing policy of product evolvement and improvement, the above specification is subject to change without notice.

ISO9001: 2000 Registered

-

Registration number 6830/2

For quotations or further information please contact us at:

3 The Business Centre, Molly Millars Lane, Wokingham, Berks, RG41 2EY, UK

http://www.actcrystals.com

6.Reliability Test

6.1 Life Test

Item

Test Condition

Limit

High Temperature Exposure

Tstg Max.(85

°C),500h

High Temperature Operation

Topr Max.( 70

°C),DC 0.5V

(In or Out),500h

Low Temperature Exposure

Tstg Min.( -55

°C),500h

Moisture Resistance

Ta=60

°C,RH=90%,500H

Δfo≤±0.5%

(

Δfo: Deviation of centre

frequency fo)

6.2 Environmental Test

Item

Test Condition

Limit

TCT

(-20

°C 30min. → 25°C 5min. → 80°C

30min.

→25

°C 5min.), 5cycles

Same as 6.1

Soldering

Immerse the pins in melt solder at 230±5

°C for 5 seconds.

More than 95% of total area

of the pins should be covered

with solder

Heat Resistivity for

Melt Solder

Set on PC board, immerse in melt solder

at 260±5

°C for 6±2 seconds.

Same as 6.1

6.3 Mechanical Test

Item

Test Condition

Limit

Drop

On maple plate from 1m high,3times.

Lead Bend

π / 2 rad bending, with 4.4N weight,2 times.

Lead Pull

After bending lead parallel to heater base, pull with 9.8N force

for 1 minute.

Same as 6.1

Issue : 1 C1

Date : SEPT 04