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AS7221

Soldering & Storage Information

Datasheet

• PUBLIC

DS000479

• v4-00 • 2019-Jun-28

│ 52

Parameter

Reference

Device

Time above Tpeak

– 10 °C (T3)

Max 10s

Peak temperature in reflow

Tpeak

260°C

Temperature gradient in cooling

Max - 5°C/s

14.1

Manufacturing Process Considerations

The AS7221 package is compatible with standard reflow no-clean and cleaning processes including

aqueous, solvent or ultrasonic techniques. However, as an open-aperture device, precautions must be

taken to avoid particulate or solvent contamination as a result of any manufacturing processes,

including pick and place, reflow, cleaning, integration assembly and/or testing. Temporary covering of

the aperture is allowed. To avoid degradation of accuracy or performance in the end product, care

should be taken that any temporary covering and associated sealants/debris are thoroughly removed

prior to any optical testing or final packaging.

14.2

Storage Information

Moisture sensitivity optical characteristics of the device can be adversely affected during the soldering

process by the release and vaporization of moisture that has been previously absorbed into the

package. To ensure the package contains the smallest amount of absorbed moisture possible, each

device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized

envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during

shipping, handling, and storage before use.

14.2.1

Shelf Life

The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date

code on the bag when stored under the following conditions:

●

Shelf Life: 12 months

●

Ambient Temperature: <40 °C

●

Relative Humidity: <90%

Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity

Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture

region.

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