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AS7331 Arkusz danych(PDF) 70 Page - ams-OSRAM AG |
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AS7331 Arkusz danych(HTML) 70 Page - ams-OSRAM AG |
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70 / 72 page ![]() Document Feedback AS7331 Soldering & Storage Information Datasheet • PUBLIC DS001047 • v4-00 • 2023-Mar-24 71 │ 69 If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 50 °C for 12 hours. |
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