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LA-T676 Arkusz danych(PDF) 13 Page - ams-OSRAM AG |
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LA-T676 Arkusz danych(HTML) 13 Page - ams-OSRAM AG |
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13 / 23 page ![]() LA T676 DATASHEET DATASHEET 13 | Version 1.6 | 2023-02-20 Recommended Solder Pad 9) OHLPY970 2.6 (0.102) Cu-area > 16 mm Cu-Fläche > 16 mm 2 2 Solder resist Lötstopplack 2.6 (0.102) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. |
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