Application hints

FC30

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5

Application hints

Figure 6.

FC30 electrical connection for 3D orientation detection

The diagram above refers to the electrical connection scheme for application of 3D

orientation detection.

The device core is supplied through the Vdd line while the I/O pads are supplied through the

Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10

µF Al) should be

placed as near as possible to pin 6 of the device (common design practice).

All the voltage and ground supplies must be present at the same time for proper behavior of

the IC (Figure 6).

5.1

Soldering information

The LGA package is compliant with the ECOPACK, RoHS and “green” standards. Leave the

pin 1 indicator unconnected during soldering. Land pattern and soldering recommendations

are available at www.st.com

6

8

13

1

Top VIEW

10uF

Vdd

100nF

GND

Vdd_IO

Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO

1

13

8

6

TOP VIEW

Land

Face

Port