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LE-CG-P1AS Arkusz danych(PDF) 13 Page - ams-OSRAM AG |
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LE-CG-P1AS Arkusz danych(HTML) 13 Page - ams-OSRAM AG |
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13 / 22 page ![]() LE CG P1AS DATASHEET DATASHEET 13 | Version 1.1 | 2025-11-05 Recommended Solder Pad 7) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. To ensure a high solder joint reliability and to minimize the risk of solder joint cracks, the customer is responsible to evaluate the combination of PCB board and solder paste material for his application. |
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