HRF-ROC09325

Preliminary

Web Site:

www.mysoiservices.com

Honeywell

Email:

mysoiservices@honeywell.com

Solid State Electronics Center

12001 State Highway 55

2002 09325

Published February 2002

Page 3

Plymouth, Minnesota 55441-4799

1-800-323-8295

Package Outline

Bottom View, 40 pin, 7.0 x 7.0 x 1.0mm

LPPC™ Package

Backside ground pad is required as the low inductance ground return for both RF and digital signals. Additionally, this

provides a direct connection to the die for enhanced thermal dissipation.

Pin Configuration

HRF-ROC09325 40 Pin LPCC

Name

LPCC Pin

Name

LPCC Pin

LNA_RF_IN

1

DIG_DATA_IN

21

GROUND*

2

SPI_DATA_ IN

22

VCO_TANK_P

3

RESET

23

VCO_TANK_M

4

SPI_CLK

24

VMOD3

5

SPI_INT_OUT

25

VMOD1

6

REXT_BE

26

VDD_VCO

7

RSSI_Q

27

TX_DATA_I

8

RSSI_I

28

PD_OUT

9

TX_ENABLE_OUT

29

GROUND*

10

RX_ENABLE_OUT

30

CLK1

11

GROUND*

31

CLK2

12

NO CONNECTION

32

GROUND*

13

VDD_BaseBand

33

VDD_PLLDIG

14

NO CONNECTION

34

XTALDIV2_OUT

15

VDD Mixer

35

RX_OUT

16

NO CONNECTION

36

TX_DATA

17

REXT_Frontend

37

REXT_PLL

18

PA_RF_OUT

38

SPI_DATA_OUT

19

VDD_PA

39

SPI_SSN

20

GROUND*

40

* Ground pins are added to aid in signal isolation. Primary RF/Digital ground is provided through backside slug pad.