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LT-H9GP Arkusz danych(PDF) 12 Page - ams-OSRAM AG |
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LT-H9GP Arkusz danych(HTML) 12 Page - ams-OSRAM AG |
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12 / 22 page ![]() LT H9GP 12 Version 1.6 | 2018-11-14 Recommended Solder Pad 8) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. In case the PCB layout of the application is intended to be used with other OSLON derivates or in future developed OSLON derivates, the heat sink must not be electrically connected to anode or cathode solder pad because of possible chip inverted polarity. Package not suitable for ultra sonic cleaning. |
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