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L6935TR Arkusz danych(PDF) 18 Page - STMicroelectronics |
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L6935TR Arkusz danych(HTML) 18 Page - STMicroelectronics |
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18 / 20 page ![]() VFQFPN20 mechanical data and package dimensions L6935 18/20 8 VFQFPN20 mechanical data and package dimensions In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 17. VFQFPN20 mechanical data and package dimensions PACKAGE AND PACKING INFORMATION VFQFPN20 (4x4x1.00mm) Weight: not available DIMENSIONS REF. mm mils MIN. TYP. MAX. MIN. TYP. MAX. A 0.80 0.90 1.00 31.496 35.433 39.370 A1 0.02 0.05 A2 0.65 A3 0.25 b 0.18 0.23 0.30 D 4.00 D2 2.70 2.80 2.90 E E2 e0.50 L 0.3 0.4 0.5 1.00 4.15 3.85 4.00 4.15 3.85 2.70 2.80 2.90 0.45 0.55 ddd 0.08 Very Fine Quad Flat Package No lead 0.787 1.969 25.591 39.370 9.843 7.087 9.055 11.811 151.57 157.48 163.39 106.30 110.24 114.17 151.57 157.48 163.39 106.30 110.24 114.17 17.717 19.685 21.654 11.811 15.748 19.685 3.150 |
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