VL6522 datasheet(30/35 Pages) STMICROELECTRONICS

30 / 35 page

Package mechanical data

VL6522

30/35

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

trademark. ECOPACK specifications are available at: www.st.com.

Caution:

The LGA package is not hermetically sealed. To prevent contamination, handle the device

carefully in a clean environment and avoid contact with any liquids.

Table 23.

POA for optical 36LGA 10X10X1.9 0.8

Reference

Data book (mm)

Typ.

Min.

Max.

1.90

1.80

2.00

0.4

0.35

0.45

0.8

0.7

0.9

2.0

3.5

0.55

0.30

0.25

0.35

10.00

9.90

10.10

9.70

9.60

9.80

5.4

e0.8

10.00

9.90

10.10

9.70

9.60

9.80

4.5

1.1

1.0

1.2

0.4

0.3

0.5

0.9

0.8

1.0

0.8

0.9

0.8

1.0

0.8

0.4

0.3

0.5

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