ST14C02C datasheet(10/12 Pages) STMICROELECTRONICS

10 / 12 page

ST14C02C

10/12

Figure 10. AC Waveforms

SCL

SDA IN

SCL

SDA OUT

SCL

SDA IN

tCHCL

tDLCL

tCHDX

START

CONDITION

tCLCH

tDXCX

tCLDX

SDA

INPUT

SDA

CHANGE

tCHDH

tDHDL

STOP &

BUS FREE

DATA VALID

tCLQV

tCLQX

DATA OUTPUT

tCHDH

STOP

CONDITION

tCHDX

START

CONDITION

WRITE CYCLE

AI00795B

ORDERING INFORMATION

Devices are shipped from the factory with the

memory content set at all ‘1’s (FFh).

The notation used for the device number is as

shown in Table 10. For a list of available options

(speed, package, etc...) or for further information

on any aspect of this device, please contact the ST

Sales Office nearest to you.

Sawn wafers are scribed and mounted in a frame

on adhesive tape. The orientation is defined by the

position of the GND pad on the die, viewed with

active area of product visible, relative to the notch-

es of the frame (as shown in Figure 11). The orien-

tation of the die with respect to the plastic frame

notches is specified by the Customer.

One further concern, when specifying devices to

be delivered in this form, is that wafers mounted

on adhesive tape must be used within a limited pe-

riod from the mounting date:

– two months, if wafers are stored at 25°C, 55%

relative humidity

– six months, if wafers are stored at 4°C, 55% rel-

ative humidity

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