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CAT3604 Arkusz danych(PDF) 9 Page - Catalyst Semiconductor |
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CAT3604 Arkusz danych(HTML) 9 Page - Catalyst Semiconductor |
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9 / 12 page ![]() CAT3604 © Catalyst Semiconductor, Inc. 9 Doc. No. MD-5008 Rev. J Characteristics subject to change without notice TYPICAL CHARACTERISTICS VIN = 3.6V, EN = VIN, CIN = COUT = 1µF, unless otherwise specified. RECOMMENDED LAYOUT When the driver is in the 1.5x charge pump mode, the 1MHz switching frequency operation requires to minimize trace length and impedance to ground on all 4 capacitors. A ground plane should cover the area on the bottom side of the PCB opposite to the IC and the bypass capacitors. Capacitors Cin and Cout require short connection to ground which can be done with multiple vias as shown on Figure 2. A square copper area matches the QFN16 exposed pad (GND) which is connected by a trace to the pin 12 pad (GND). A large via (metalized hole) centered in the square pad provides a low impedance connection to the ground plane on the opposite side of the PCB and allows the heat dissipated by the driver IC to spread out resulting in excellent thermal performance. Figure 2. PCB Layout Figure 3. Recommended QFN 16 Package Land Pattern Foldback Current Limiting 0 1 2 3 4 5 0 100 200 300 400 500 OUTPUT CURRENT [mA] 1x mode 2.25mm 0.35mm 0.65mm |
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