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STR910FAW32 Arkusz danych(PDF) 97 Page - STMicroelectronics |
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STR910FAW32 Arkusz danych(HTML) 97 Page - STMicroelectronics |
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97 / 101 page ![]() STR91xFAx3x, STR91xFAx4x Package mechanical data 97/101 9.1 Soldering information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label (JEDEC 020C). ECOPACK is an ST trademark. ECOPACK® specifications are available at www.st.com. |
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