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ST6200 Arkusz danych(PDF) 88 Page - STMicroelectronics |
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ST6200 Arkusz danych(HTML) 88 Page - STMicroelectronics |
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88 / 100 page ![]() ST6200C/ST6201C/ST6203C 88/100 11.2 THERMAL CHARACTERISTICS Notes: 1. The power dissipation is obtained from the formula PD = PINT + PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation determined by the user. 2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) DIP16 SO16 SSOP16 90 90 125 °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C 1 |
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